AX high pressure water deburring cleaning machine

■Applicable objects:

  IC, LSI resin package
  Crystal (transistor) tube, diode and other single semiconductor resin package
  QFN type resin package
  Use high-pressure water to remove flashes, burrs and foreign objects that occur during the resin molding process on the above products
■Features:

  Single channel loading system
   Conveying speed 10~120mm/s
   Diamond nozzle
  The fixture for fixing the lead frame is roller type
   takes up less space